On October 18th, the Third International Workshop on Advanced Patterning Solutions (IWAPS 2019) was held in Nanjing. The workshop was hosted by the Integrated Circuit Industry Technology Innovation Alliance (ICTIA) and the Chinese Optical Society (COS). Professor WANG Xiangzhao led SIOM team to attend the meeting and he also served as a member of the International Advisory Committee.

Five papers from SIOM were published in the workshop, among which "Profile reconstruction method for multilayer defect in Extreme Ultraviolet Lithography" by Wei Cheng, Sikun Li*, Xiangzhao Wang*, Zinan Zhang gained the “Best Paper Award”. Dr. Will Conley from ASML Cymer, the Chair of SPIE Advanced Lithography symposium 2020, presented the award.

IWAPS aims to provide a forum for worldwide experts to share the achievements of advanced lithography technology and carry out cooperation and communication. IWAPS 2019 was the first workshop of the advanced lithography technology taking place in China.
For more information, please refer to the official website of IWAPS at https://www.iwaps.org/.